Sizzix Accessory - Die Brush & Foam Pad for Wafer-Thin Dies
- 44,90 zł
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Warszawa VarsoChmielna 73
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Warszawa Plac Konesera 10A
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Kraków Pawia 34
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Gdańsk Rajska 10
-
Poznań Plac Wolności 8
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Wrocław Krupnicza 6/8
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Katowice Krzywa 12
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Sklep online
Quantity: 1
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Warszawa - Varso
Chmielna 73
00-801 Warszawa
phone +48 22 299 19 16
mobile +48 534 588 345
[email protected]Quantity: -
Kraków
Pawia 34
31-154 Kraków
phone +48 12 313 25 80
mobile +48 536 588 438
[email protected]Quantity: -
Poznań
Plac Wolności 8
61-738 Poznań
phone +48 61 415 44 44
mobile +48 884 333 068
[email protected]Quantity: -
Wrocław
ul. Krupnicza 6/8
50-075 Wrocław
phone +48 71 729 40 54
mobile +48 884 333 216
[email protected]Quantity: -
Katowice
ul. Krzywa 12
(enterance from ul. Skłodowskiej‑Curie)
40-061 Katowice
phone +48 32 203 04 12
mobile +48 534 588 868
[email protected]Quantity: -
Warszawa
Plac Konesera 10A
03-736 Warszawa
phone +48 22 210 42 02
mobile +48 534 588 382
[email protected]Quantity: -
Gdańsk
Madison Shopping Mall
ul. Rajska 10
80-850 Gdańsk
phone +48 58 766 74 35
mobile +48 534 588 698
[email protected]Quantity:
The quantity of products listed is for reference only.
When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy maneuverability, the Die Brush easily rolls away excess paper to reveal the perfect cut! The Die Brush includes a Foam Pad that acts as the perfect work surface for removing excess paper from the dies and even the cutout.
DIMENSIONS MATS: 11,43 x 18,42 cm
PACKAGE: 1 brush + 1 brush mat
REFERENCE: SIZ-660513
EAN: 841182097989
COMPANY: Sizzix
